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PAT provides low-volume flip chip assembly services for fine-pitch (100µm) pixel imaging devices and temp-sensitive II-VI and III-V devices, including:

optical,
radiation,
bio-medical sensors, and
optical/polymer-MEMS.

High-density interconnects are made using low applied forces onto low-temp curing, silver-filled (non-leaded) conductive epoxies that are applied using a patented stencil printing technique. This technology offers a low-cost alternative to indium (Hybridization) bump bonding.






	PAT provides low-volume flip chip assembly services for fine-pitch (100µm) pixel imaging devices and temp-sensitive II-VI and III-V devices, including: optical, radiation, bio-medical sensors, and optical/polymer-MEMS. High-density interconnects are made using low applied forces onto low-temp curing, silver-filled (non-leaded) conductive epoxies that are applied using a patented stencil printing technique. This technology offers a low-cost alternative to indium (Hybridization) bump bonding.			Announcements PAT has moved to new location! PAT completed its transition to The Research Triangle Park of North Carolina in October of 2006 to form a new company called MICROELECTRONICS ASSEMBLY TECHNOLOGIES, INC. The new name was chosen to represent the company's expanding capabilities for developing high density packaging solutions for memory and microprocessor devices. MAT will continue to provide high density adhesive flip chip assembly services for imaging sensors and MEMS devices using PAT's proprietary technology, but will also develope unique direct chip attach (DCA) techniques for chip-on-flex (COF) multichip modules. Visit MAT's website for further details : www.microassemblytech.com