PAT provides low-volume flip chip assembly services for fine-pitch (100µm) pixel imaging devices and temp-sensitive II-VI and III-V devices, including:

  • optical,
  • radiation,
  • bio-medical sensors, and
  • optical/polymer-MEMS.

High-density interconnects are made using low applied forces onto low-temp curing, silver-filled (non-leaded) conductive epoxies that are applied using a patented stencil printing technique. This technology offers a low-cost alternative to indium (Hybridization) bump bonding.